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Precision metering, mixing, controlling, and dispensing for all applications.

Kirkco

NDA Protected Application

Epoxy Encapsulation for Industrial Sensor Modules

Executive Overview

Kirkco engineered an epoxy encapsulation architecture for industrial sensor modules operating in harsh environments where moisture ingress, vibration, and thermal cycling can compromise signal integrity. The architecture delivers repeatable, void-free encapsulation while supporting multi-variant sensor production.

Business & Quality Drivers

Sensor manufacturers require stable output and long service life to meet uptime guarantees and reduce warranty exposure. Manual potting introduced variability in fill quality and cure behavior, leading to drift and early failures. A controlled encapsulation approach was required to standardize quality.

Process Requirements

The application required two-component epoxy encapsulation with precise ratio control, temperature-conditioned delivery, and defined shot volumes to ensure consistent coverage of sensitive elements and interconnects.

System Architecture

The encapsulation platform utilizes precision metering and mixing with point-of-application dispense. Temperature control across supply, metering, and mixing maintains viscosity stability and predictable flow into compact housings.

Controls & Validation

PLC-based controls manage recipes, ratio monitoring, and automated flushing. Validated process windows ensure repeatable encapsulation performance across sensor variants and production shifts.

Encapsulation Quality Framework Alignment

This application aligns with Kirkco’s encapsulation quality framework, standardizing ratio stability, thermal control, void mitigation, and validation practices across encapsulation programs. Reference: Encapsulating Quality – Application Architecture (Rev C).

Operational Performance

Implementation improved encapsulation uniformity, reduced scrap, and stabilized sensor performance under environmental stress.

Lifecycle & Scalability

The architecture supports future sensor designs, material changes, and throughput increases without redesign of the core platform.

Adhesives & SealantsTwo-Component Adhesive Metering & Mixing Systems